COMMITTEE

Committee Members

ISCSI-X	ICSI/ISTDM2025
Organizing Committee Chair      Kenji Shiojima, Univ. of Fukui, Japan Vice-Chairs Yasuo Koide, NIMS, Japan	Organizing Committee Chair    Osamu Nakatsuka, Nagoya Univ., Japan Vice-Chairs Roger Loo, IMEC, Belgium
International Advisory Committee Chair     Junichi Murota, Tohoku Univ., Japan Akira Toriumi, The Univ. of Tokyo, Japan 　 Seiichi Miyazaki, Hiroshima Univ., Japan Shigeaki Zaima, Meijyo Univ., Japan 　 　 Tetsuya Yamamoto, Kochi Univ. of Technology, Japan Toshimichi Ito, Osaka Univ., Japan 　 　Tsugunori Okumura, Tokyo Metropolitan Univ., Japan 　 　 Ya-Hong Xie, UCLA Samueli School of Engineering, U.S.A. Yuji Yamamoto, IHP, Germany 　 　 　Yukio Yasuda, Nagoya Univ., Japan International Technical Program Committee Chair   Katsunori Makihara, Nagoya Univ., Japan Vice-Chairs Keisuke Yamamoto, Kumamoto Univ., Japan Hiroyuki Fujimori, GlobalWafers Japan, Japan Antonio Abate, Helmholtz Center Berlin, Germany Tanemasa Asano, Kyushu Univ., Japan Patrick Chin, IntelliEPI, USA Stefano Chiussi, Univ. of Vigo, Spain Valentin Craciun, INFLPR, Romania Hiroyuki Fujimori Japan GlobalWafers Japan, Japan Kohei Fujiwara, Tohoku Univ., Japan Yasufumi Fujiwara, Osaka Univ., Japan Susumu Fukatsu, Univ. of Tokyo, Japan Detlev Gruetzmacher, Forschungszentrum Jülich, Germany Qixin Guo, Saga Univ., Japan Fumihiko Hirose, Yamagata Univ., Japan Yoshio Honda, Nagoya Univ., Japan Masaru Hori, Nagoya Univ., Japan Fumimasa Horikiri, SCIOCS, Japan Masahiro Horita, Nagoya Univ., Japan Masao Inoue, Renesas Electronics, Japan Naho Itagaki, Kyushu Univ., Japan Masaru Kadoshima, KOKUSAI ELECTRIC, Japan Hiroyuki Kageshima, Shimane Univ., Japan Eiji Kamiyama, GlobalWafers Japan, Japan Tsunenobu Kimoto, Kyoto Univ., Japan Gudrun Kissinger, IHP-Leibniz, Germany Takashi Kita, Kobe Univ., Japan Kiyoteru Kobayashi, Tokai Univ, Japan Takashi Koida, AIST, Japan Yasuo Koide, NIMS, Japan Takashi Kondo, The Univ. of Tokyo, Japan Katsuhiro Kutsuki, Toyota Central R&D Labs., Japan Chee-Wee Liu, National Taiwan Univ., Taiwan Roger Loo, IMEC, Belgium Hisao Makino, Kochi Univ. of Technology, Japan Yutaka Mera, Shiga Univ. of Medical Science, Japan Tomoyoshi Mishima, Hosei Univ., Japan Takashi Nakayama, Chiba Univ., Japan Katsuhiko Nishiguchi, Nippon Telegraph and Telephone, Japan Noboru Ohtani, Kwansei Gakuin Univ., Japan Kenji Okada, Tower Partners Semiconductor, Japan Yoshitaka Okada, The Univ. of Tokyo, Japan Douglas J. Paul, Univ. of Glasgow, UK Guus Rijnders, Univ. of Twente, Netherlands Wataru Saito, Kyushu Univ. Japan Akira Sakai, Osaka Univ., Japan Florencio Sanchez, ICMAB-CSIC, Spain Kenji Shiraishi, Nagoya Univ., Japan Koji Sueoka, Okayama Prefectural Univ., Japan Masakazu Sugiyama, The Univ. of Tokyo, Japan Jacobo SantamariaSanchez-Barriga, Complutense Univ. of Madrid, Spain Hitoshi Tabata, The Univ. of Tokyo, Japan Shin-ichi Takagi, The Univ. of Tokyo, Japan Mayumi B. Takeyama, Kitami Institute of Technology, Japan Katsuaki Tanabe, Kyoto Univ., Japan Hirokazu Tatsuoka, Shizuoka Univ., Japan Tokuyuki Teraji, NIMS, Japan Takashi Tokuda, Tokyo Institute of Technology, Japan Noritaka Usami, Nagoya Univ., Japan Noriyuki Watanabe, NTT Advanced Technology, Japan Tetsuya Yamamoto, Kochi Univ. of Technology, Japan Wenchang Yeh, Shimane Univ., Japan	International Advisory Committee Chair 　 Roger Loo, IMEC, Belgium Matthias Bauer, Mattson Technology, USA Dan Buca, FZ-Juelich, Germany Eugene A. Fitzgerald, Massachusetts Institute of Technology, USA Detlev Grutzmacher, FZ-Juelich, Germany Jean Michel Hartmann, CEA-LETI, Germany Judy Hoyt, Massachusetts Institute of Technology, USA Zuimin Jiang, Fudan Univ. China Steven Koester, Univ. of Minnesota, USA Chee Wee Liu, National Taiwan Univ., Taiwan Seiichi Miyazaki, Hiroshima Univ. Japan Oussama Moutanabbir, Univ. of Montreal, Canada Maksym Myronov, Univ. of Warwick, UK Junichi Murota, Tohoku Univ. Japan Wei-Xin Ni, Linköping Univ. Sweden Michael Oehme, Stuttgart Univ. Germany Mikael Östling, KTH Sweden, Sweden Alexander Rezniceck, IBM, USA Kentarou Sawano, Tokyo City Univ. Japan Thomas Schröder, IKZ-Berlin, Germany James Sturm, Princeton Univ. USA Shinichi Takagi, Univ. of Tokyo, Japan John Tolle, Applied Materials, USA Yuji Yamamoto, IHP-Frankfurt Oder, Germany Yee-Chia Yeo, National Univ. of Singapore, Singapore Shigeaki Zaima, Meijo Univ. Japan International Technical Program Committee Chair    Tatsuro Maeda, AIST, Japan Vice-Chairs Yuji Yamamoto, IHP, Germany Dan Buca, Research Center Juelich, Germany Giovanni Capellini, IHP and Università Roma Tre, Germany Kohei Hamaya, Osaka Univ., Japan Seiichiro Higashi, Hiroshima Univ. Japan Isella Giovanni, Politecnico di Milano, Italy Chee Wee Liu, National Taiwan Univ., Taiwan Roger Loo, IMEC, Belgium Oussama Moutanabbir, Polytechnique Montréal, Canada Atsushi Ogura, Meiji Univ., Japan Takahiro Ono, Tohoku Univ. Japan John Tolle, Applied Materials, USA Wang Dong, Kyushu Univ., Japan

Steering Committee Chair 　 　 Koji Kita, The Univ. of Tokyo, Japan Vice-Chairs  Takanobu Watanabe, Waseda Univ., Japan

Local Arrangement Committee Chair　　Shun-ichiro Ohmi, Inst. of Science Tokyo, Japan Vice-Chairs 　Kentarou Sawano, Tokyo City Univ., Japan

Publication Committee for Proceedings Chair       Taizoh Sadoh, Kyushu Univ., Japan

ISCSI-X

ICSI/ISTDM2025